Details
DS1066-10
2.00mm PHB V/T TYPE Wafer & Housing Crimp type
| Product series | DS1066-10 |
| Pitch | 2.00mm |
| Product description | Wafer & Housing PHB Type |
| No.of contacts | 2x2~2x20 |
| Products type | Wire to Board |
| Mounting type | V/T Crimp |
| Coldering temperature | 240±5℃ |
| Rated currency | 2A Max |
| Rated voltage | 125V AC/DC |
| Contact resistance | 30mΩ Max |
| Insulation resistance | 1000MΩ minimum |
| Withstand voltage | 500V AC 1minitue |
| Operation temperature | -25~+85℃ |
| Housing material | PA66 |
| Plastic flame rating | UL94 V0 |
| Housing color | Ivory/White |
| Pin material | Copper alloy |
| Pin plating | Tin |
| Packing type | polybag/Reel |
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