Details
DS1067
2.00mm Wafer & Housing SAN Type
| Product series | DS1067 |
| Pitch | 2.00mm |
| Product description | Wafer & Housing SAN Type |
| No.of contacts | 2~15 |
| Products type | Wire to Board |
| Coldering temperature | 240±5℃ |
| Rated currency | 1.5A(AWG#24) |
| Rated voltage | 125V |
| Contact resistance | 30mΩ Max |
| Insulation resistance | 1000MΩ minimum |
| Withstand voltage | 500V AC 1minitue |
| Operation temperature | -25~+85℃ |
| Housing material | LCP |
| Housing color | White/Transparent |
| Pin material | Copper alloy |
| Pin plating | Tin plating |
| Packing type | bagged |
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