DS1069-01
2.50mm Wafer & Housing EH Type
| Product series | DS1069-01 |
| Pitch | 2.50mm |
| Product description | Wafer & Housing EH Type |
| No.of contacts | 2~20 |
| Products type | Wire to Board |
| Mounting type | V/T R/A Crimp |
| Coldering temperature | 240±5℃ |
| Rated currency | 3A Max |
| Rated voltage | 250V AC/DC |
| Contact resistance | 30mΩ Max |
| Insulation resistance | 1000MΩ minimum |
| Withstand voltage | 600V AC 1minitue |
| Operation temperature | -25~+85℃ |
| Applicable wire diameter | 22~30AWG |
| Housing material | PA66 |
| Plastic flame rating | / |
| Housing color | White |
| Pin material | Copper alloy |
| Pin plating | Tin plating |


| Packing type | polybag/Reel |

Connector A device used to connect two active devices to transmit current or signals.

Connector A device used to connect two active devices to transmit current or signals.

Connector A device used to connect two active devices to transmit current or signals.

Connector A device used to connect two active devices to transmit current or signals.