DS1069-11
2.50mm XH Wafer SMT Type
| Product series | DS1069-11 |
| Pitch | 2.50mm |
| Product description | XH Wafer SMT Type |
| No.of contacts | 2~12 |
| Products type | Wire to Board |
| Mounting type | / |
| Coldering temperature | 260±5℃ |
| Rated currency | 3A |
| Rated voltage | 250V |
| Contact resistance | 30mΩ Max |
| Insulation resistance | 1000MΩ minimum |
| Withstand voltage | 1000V AC 1minitue |
| Operation temperature | -25~+85℃ |
| Applicable wire diameter | / |
| Housing material | / |
| Plastic flame rating | UL94V-0 |
| Housing color | White/Ivory |
| Pin material | Copper alloy |
| Pin plating | Tin plating |


| Packing type | Tube/Tape |

Connector A device used to connect two active devices to transmit current or signals.

Connector A device used to connect two active devices to transmit current or signals.

Connector A device used to connect two active devices to transmit current or signals.

Connector A device used to connect two active devices to transmit current or signals.