DS1070-06
2.54mm wafer & Housing Crimp Type
| Product series | DS1070-06 |
| Pitch | 2.54mm |
| Product description | Wafer & Housing Crimp Type |
| No.of contacts | 2~18 |
| Products type | Wire to Board |
| Mounting type | V/T R/A Crimp |
| Coldering temperature | 240±5℃ |
| Rated currency | 3A Max |
| Rated voltage | 250V AC/DC |
| Contact resistance | 30mΩ 最大 |
| Insulation resistance | 1000MΩ minimum |
| Withstand voltage | 500V AC 1minitue |
| Operation temperature | -25~+85℃ |
| Applicable wire diameter | 24~28AWG |
| Housing material | Nylon |
| Plastic flame rating | UL94 V0 |
| Housing color | Black |
| Pin material | Copper alloy |
| Pin plating | Gold/Tin |


| Packing type | polybag/Reel |

Connector A device used to connect two active devices to transmit current or signals.

Connector A device used to connect two active devices to transmit current or signals.

Connector A device used to connect two active devices to transmit current or signals.

Connector A device used to connect two active devices to transmit current or signals.