1.25mm GH Wafer V/T SMT & Crimp Type
| Product series | DS1147-04 |
| Pitch | 1.25mm |
| Product description | 1.25MM GH WAFER V/T SMT & CRIMP TYPE |
| No.of contacts | 02~20 |
| Products type | Wire to Board |
| Coldering temperature | 260±5℃ |
| Rated currency | 0.5A(AWG#28) |
| Rated voltage | 30V |
| Contact resistance | 20mΩ Max |
| Insulation resistance | 100MΩ minimum |
| Withstand voltage | 250V AC 1minitue |
| Operation temperature | -40~+85℃ |
| Housing material | Plastic |
| Plastic flame rating | UL94V-0/UL94V-2/UL94HB |
| Housing color | Ivory/White |
| Pin material | Copper alloy |
| Pin plating | Tin plating |


| Packing type | Reel/Tube |

Connector A device used to connect two active devices to transmit current or signals.

Connector A device used to connect two active devices to transmit current or signals.

Connector A device used to connect two active devices to transmit current or signals.

Connector A device used to connect two active devices to transmit current or signals.